0001590714-26-000018
SEC filing2025年营收增长4%至$2.55B,但净利下滑22%,主因MGS剥离及一次性费用。
| 指标 | 本期 | 去年同期 | 同比 |
|---|---|---|---|
| Net Sales | $2,551.2M | $2,456.9M | +4% |
| Gross Profit | $1,070.5M | $1,035.7M | +3% |
| Gross Margin | 42.0% | 42.2% | -20bps |
| Operating Income | $342.2M | $343.9M | -1% |
| Operating Margin | 13.4% | 14.0% | -60bps |
| Net Income | $191.0M | $244.5M | -22% |
| Diluted EPS | $0.79 | $1.00 | -21% |
| Adjusted EBITDA | $547.6M | $534.7M | +2% |
| Operating Cash Flow | $289.8M | $362.0M | -20% |
| Free Cash Flow | $227.6M | $293.6M | -22% |
2025年营收增长4%至$2.55B,有机增长6%,主要受Electronics业务驱动,其中Assembly Solutions、Circuitry Solutions和Semiconductor Solutions分别实现8%、10%和13%的有机增长。Specialties业务因MGS剥离营收下降15%,但有机增长1%。
毛利率下降20bps至42.0%,主要因Electronics业务中锡和银等金属价格传导的负面影响,部分被Specialties业务因剥离低毛利Graphics Solutions带来的毛利率提升所抵消。经营利润率下降60bps,主要受$37.1M高管股权激励费用和$47.2M金属衍生品损失影响。
净利下降22%至$191.0M,主要受MGS剥离收益($66.5M)被一次性费用抵消,以及有效税率上升至28.1%的影响。剔除一次性项目后,调整后EBITDA增长2%至$547.6M,调整后EBITDA利润率下降30bps至21.5%。
| 分部 | 营收 | 同比 | 经营利润/EBITDA | 利润率 | 驱动 |
|---|---|---|---|---|---|
| Electronics | $1,786.2M | +14% | $382.2M | 21.4% | AI与数据中心需求,Assembly Solutions增长16% |
| Specialties | $765.0M | -15% | $165.4M | 21.6% | MGS剥离拖累,有机增长1% |
| 项目 | 本期 | 上期/变化 |
|---|---|---|
| Cash & ST investments | $626.5M | +$267.1M |
| Total Debt | $1,625.9M | -$187.7M |
| Inventory | $294.7M | +$48.5M |
| Operating Cash Flow | $289.8M | -$72.2M |
| Capex | $62.2M | -$6.2M |
| Free Cash Flow | $227.6M | -$66.0M |
Net Debt = $1,625.9M - $626.5M = $999.4M;Net Debt/EBITDA = 1.8x。