Topic: Vcore Power acquisition details and vertical GaN development
Key points:
Vcore Power acquisition complements existing Treo platform; products will generate revenue in 2026 (short-term), with long-term redesign on Treo for architectural advantage.
Vertical GaN (vGaN) has better reliability than lateral GaN; die size does not increase with voltage due to vertical current flow.
vGaN samples already with lead customers in AI and automotive; no competitor sampling such technology externally.
Mgmt stance: Bullish on vGaN – calls it a breakthrough technology solving high-voltage, high-efficiency needs.
Q7 — Joseph Quatrochi
Topic: SiC revenue growth outlook and short lead time orders
Key points:
SiC revenue coming in exactly as expected; gaining share in China with NIO new brand design-win and a leading Tier 1 giving exposure beyond top 10 OEMs.
Lead times pushed out to ~20 weeks; short lead time order patterns unchanged, but backlog layering continues improving.
Mgmt stance: Neutral/Positive – SiC on track, order patterns improving, giving confidence in stabilization.
Q8 — Joshua Buchalter
Topic: Geographic revenue swings and die bank inventory buildup
Key points:
Americas strength partly due to large customer shifting orders from Europe to Japan; normalize for that, Japan down slightly, Europe up.
Inventory at 112 days (low end of 110–120 target); die bank buildup is for mass market where customer count increased ~20% YoY.
Even with die bank increase, total inventory declined $39M QoQ due to mix shift.
Mgmt stance: Neutral – sees inventory discipline maintained; die bank justified by demand growth, not blind building.
Q9 — Tore Svanberg
Topic: Power delivery IP completeness from grid to processor and vGaN timeline
Key points:
For next couple of years, all needed IP either owned or in development (organic & inorganic); product count on Treo doubled YoY.
vGaN development started via IP/assets acquisition in 2024; fab turned on, first products sampled to lead customers; second generation already in work.
vGaN revenue expected around 2027 timeframe.
Mgmt stance: Bullish on IP toolbox – confident to capture share in AI data centers and automotive.
Q10 — Christopher Rolland
Topic: AI power tree applications (solid-state transformers, 48V bus, hot swaps) and SiC geography/300mm
Key points:
Already addresses every mentioned power tree block today; expanding portfolio.
SiC now gaining share in AI data center PSUs (JFET and SiC MOSFETs) and plug-in hybrids; geographic outlook matches electrification (China, U.S., then Europe/Japan).
8-inch SiC fab in production at 350-micron thickness, shipping production on track in 2026; 300mm is very early, not in short-term models.
Mgmt stance: Bullish on SiC portfolio and AI opportunities; cautious on 300mm – too far from now, no new applications.